METHOD FOR OBTAINING A THIN HIGH-QUALITY LAYER BY CO-IMPLANTATION AND THERMAL ANNEALING

摘要

The invention relates to a method for creating a structure comprising a thin semiconductor material layer on a substrate, comprising the following steps: a species is implanted underneath a surface of a donor substrate wherefrom the thin layer is to be made in order to create an area of embrittlement inside the thickness of the donor substrate; the surface of the donor substrate which underwent implantation is placed in intimate contact with a support substrate; the donor substrate is detached at said area of embrittlement in order to transfer part of the donor substrate onto the support substrate and to form the thin layer thereon. The invention is characterized in that the implementation step involves co-implementation of at least two different atomic species in order to minimize low frequency roughness in the structure obtained after detachment; the method also comprises a finishing step comprising at least one rapid thermal annealing operation in order to minimize high frequency roughness in the structure obtained after detachment.