| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To perform waterproof treatment in a simple process, related to a circuit configuration, along with its manufacturing method, where a circuit body inside a case is treated for waterproof. <P>SOLUTION: An adhesive sheet 18 that bonds a heat radiation member 10 to a circuit body constituting a power circuit is used to bond the heat radiation member 10 to a case body 20. Thus, a space is provided which is formed of the bonding surface of the heat radiation member 10 and the inside surface that encloses the circuit body of the case body 20, and the gap between the bottom surface of the case body 20 and the bonding surface of the heat radiation plate 10 is surely stopped. The space is filled with a liquid waterproof resin until at least the part of the circuit body which is an object for waterproofing is sealed up, and the waterproofing resin is solidified to form a waterproof layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
