发明名称 |
Optical pickup module and manufacturing method thereof |
摘要 |
Disclosed are an optical pickup module and a manufacturing method thereof. The manufacturing method of an optical pickup module comprises the steps of: forming a wet-etching mask layer at an outer portion of an upper surface of a silicon substrate to be used as a sub mount; etching a middle portion of the silicon substrate by using the wet-etching mask layer thereby forming a cavity, forming an inclination surface at the etched portion, and then removing the wet-etching mask layer; forming an insulating layer on an entire upper surface of the silicon substrate; forming an electrode layer on an upper surface of the insulating layer; forming adhesive layers at a part of an upper surface of the electrode layer; and arranging a light emitting device at an upper surface of one adhesive layer and arranging an MPD at an upper surface of another adhesive layer by a fixation thereby completing an optical pickup module.
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申请公布号 |
US2005063279(A1) |
申请公布日期 |
2005.03.24 |
申请号 |
US20040980784 |
申请日期 |
2004.11.04 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
SONG KI-CHANG;KIM GEUN-HO;KIM SUN-HO |
分类号 |
G11B3/085;G11B7/12;G11B7/125;(IPC1-7):G11B3/00 |
主分类号 |
G11B3/085 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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