CONDUCTOR-WITHIN-A-VIA MICROWAVE LAUNCH

摘要

A concentric 'conductor within a via' RF interconnect architecture, has an inner via (63) through which at least one RF signal conductor passes. The inner conductive via is coaxially formed within and stably coaxially aligned within an outer conductive via (53), which serves as a coaxial ground plane that completely surrounds the inner conductive via. The outer conductive via passes through dielectric layers (61, 62) of microstrip or stripline structures (71, 72) on opposite sides of a multi printed circuit laminate (30).