| 摘要 |
<p>Disclosed is a resin composite film which enables to form a flexible printed board excellent in insulating properties, mechanical characteristics enabling bending, and adhesion properties. A resin composite film wherein at least one side of a resin layer A is provided with a resin layer B is characterized in that the resin layer B has a thickness of 0.1-4 mum and is composed of an insulating material which enables to form a 10 mum thick film with a water absorption of 0.03-0.25%. By forming a metal layer on the front side of the resin layer B of this resin composite film, there can be obtained a metal-resin composite film.</p> |
