| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composite substrate for forming semiconductor light-emitting elements capable of substantially increasing productivity, and to provide a method for manufacturing the composite substrate for forming the semiconductor light-emitting elements and a method for manufacturing the semiconductor light-emitting elements. <P>SOLUTION: A resist 23 is formed on a plane metal layer 5 for electroplating, thus easily forming bumps 6, 7 having excellent shape precision and quality in quantity in a wafer 24 at a light-emitting element side. Additionally, a wafer 26 at a submount member side joined to the wafer 24 at the light-emitting element via the bumps 6, 7 is electrically connected to electrodes 17, 18 for packaging an external circuit via through holes 19, 20, thus easily manufacturing a sub-mount type member-packaging flip-chip type semiconductor light-emitting elements that do not require connection members, such as a wire in large quantity. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
