| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a suction mechanism which can suck, without wrinkling, a board which is a thin product having a bend or warp, in manufacturing and testing a printed wiring board and various wiring boards for a semiconductor package such as BGA, CSP, TAB, etc. <P>SOLUTION: The suction mechanism sucks a board when manufacturing or testing the same. The suction mechanism comprises a suction table and a convex type elastic body arranged opposite to the top face of the suction table. The board is placed on the suction table. By making the suction table suck the board placed on the suction table after pushing the board downward by the elastic body or while pushing the board against the suction table by the elastic body, the board can be sucked without wrinkling. The suction table is formed with a plurality of suction holes in the surface. The inside of the suction table is divided into a plurality of concentric zones, and the board is sucked in order from a central zone toward the most outer zone. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
