PATTERN FAILURE PREDICTING APPARATUS, SUBSTRATE PROCESSING SYSTEM, PATTERN FAILURE PREDICTING PROGRAM, AND INFORMATION RECORDING MEDIUM

摘要

PROBLEM TO BE SOLVED: To rapidly and easily detect the place of a substrate wherein the probability of its failure occurrence is high. SOLUTION: A plurality of substrate processing apparatuses 11 and a maintenance/management server 13 are provided in a substrate processing factory 10. Each substrate processing apparatus 11 has a scanning-exposure type exposure device for transcribing sequentially the pattern formed in a reticle on a wafer via a projection optical system while moving the reticle and the wafer synchronously with each other. The maintenance/management server 13 so uses the information for indicating the optical characteristic of the projection optical system provided in the exposure device and the information for indicating the synchronous error of the wafer with the reticle as to predict the line width of the pattern formed on the wafer. Further, it so determines whether the line-width error generated between the determined line-width and a preset reference line-width exceeds a preset threshold or not that when determined that the error exceeds the threshold it warns thereof. COPYRIGHT: (C)2005,JPO&NCIPI