| 摘要 |
PROBLEM TO BE SOLVED: To form a metal wiring at high resolution by a few simple processes while reducing an amount of waste liquid. SOLUTION: The method of forming the metal wiring on a substrate for an electronic circuit comprises a first step and a second step. In the first step, a transparent laser beam irradiates the substrate for an electronic circuit, and also plasmas are generated in the proximity of the face of the substrate for an electronic circuit where the wiring is to be formed, and then the plasmas and the laser light irradiating the substrate are made to interact with each other to cause ablation in the face of the substrate. Consequently, an etching groove is formed by the ablation in the face of the substrate, and then a metal thin film is deposited on the bottom of the etching groove. In the second step, metal is deposited inside the etching groove formed by the first step. COPYRIGHT: (C)2005,JPO&NCIPI
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