| 摘要 |
PROBLEM TO BE SOLVED: To restrain generation of particles, prevent watermark of a processed substrate and improve recovery efficiency of process liquid, by preventing sticking of the process liquid on a non-rotary part. SOLUTION: This substrate is provided with a spin chuck 10 which holds rotatably a semiconductor wafer W, a hollow motor 12 which performs rotation drive of the spin chuck 10, a nozzle 20 which supplies the process liquid suitably to the surface of the wafer W held by the spin chuck 10, an outer chamber 32 which stores the spin chuck 10, and an inner cup 31. A cover member 50 which prevents the lower part side non-rotary part of the spin chuck 10 from sticking of the process liquid is peripherally arranged at lower periphery of the spin chuck 10. As a result, the cover member 50 catches the process liquid which falls below the spin chuck 10 at the time of treatment, and the process liquid can be dispersed (exhausted) in the direction of periphery of the wafer W with centrifugal force by rotation of the spin chuck 10. COPYRIGHT: (C)2005,JPO&NCIPI
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