发明名称 CONDUCTIVE RESIN COMPOSITION AND MOLDED OBJECT
摘要 <p>A conductive resin composition characterized in that it comprises a polyamide (A), a polyphenylene ether (B) (terminal-unmodified polyphenylene ether and/or terminal-modified polyphenylene ether), a rubbery polymer (C), a conductive carbonaceous material (D) (carbon black and/or carbon fibrils), and a low-molecular modifier compound (E) (compatibilizing agent) and is produced by melt-kneading a mixture comprising the ingredients (A) to (E), and that the mixture has the following properties (1) to (3): (1) the amount of the ingredient (D) is 0.2 to 3 mass% based on the total amount of the ingredients (A) to (E); (2) the amount of the ingredient (E) is larger than 0.01 mass% and less than 0.20 mass% based on the total amount of the ingredients (A) to (E); and (3) the amount (a) of volatiles present in the ingredient (B) satisfies the relationship 0<=a<=-7.3xE+1.83 (E is the amount of the ingredient (E) (mass%)), provided that the amount (a) is the mass loss of the ingredient (B) (mass%) through 1-hour vacuum drying at 180°C.</p>
申请公布号 WO2005026260(A1) 申请公布日期 2005.03.24
申请号 WO2004JP13230 申请日期 2004.09.10
申请人 ASAHI KASEI CHEMICALS CORPORATION;NODA, KAZUYA;NISHINO, HIROSHI;SAKATA, NORIO 发明人 NODA, KAZUYA;NISHINO, HIROSHI;SAKATA, NORIO
分类号 C08K3/04;C08K7/06;C08L21/00;C08L53/02;C08L71/12;C08L77/00;C08L77/02;C08L77/06;(IPC1-7):C08L77/00;C08K5/09 主分类号 C08K3/04
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