| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a grooved polishing sheet for efficiently forming balanced grooves and suppressing the occurrence of an up-warp and waviness of the polishing sheet caused by machining the grooves, and also to provide a polishing sheet machining and grooving tool for use in the manufacturing method, the grooved polishing sheet and a grooved polishing pad manufactured by the method, and a method of manufacturing a semiconductor device using them. <P>SOLUTION: In the method of manufacturing the grooved polishing sheet including a process of machining many grooves of concentric circles on the surface of the polishing sheet, a multi-edged unit provided with a plurality of single cutting edges each machining one groove, laminated at the same spaces d to simultaneously machine a plurality of grooves in one machining, is used as a tool for machining the grooves. After performing an equal space grooving process for forming equally spaced grooves at spaces d on the polishing sheet by moving the multi-edged unit once or more in a radial direction, a grooving process is performed (n-1) times while shifting by d/n (n is an integer of 2 or more) so that all the grooves formed on the surface of the polishing sheet are concentric with the same groove pitch d/n. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
