发明名称 COMPOSITION FOR TRANSPARENT CONDUCTIVE FILM FORMATION, FORMING METHOD OF TRANSPARENT CONDUCTIVE FILM, TRANSPARENT CONDUCTIVE FILM, ELECTRON DEVICE, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a composition for transparent conductive film formation with which a transparent conductive film excellent in various characteristics can be formed, a forming method of the transparent conductive film using such a composition for transparent conductive film formation, a transparent conductive film excellent in various characteristics, and an electron device as well as an electronic apparatus with high reliability. SOLUTION: The composition for transparent conductive film formation, used for forming the transparent conductive film, contains conductive particles 9, a densification promoting agent 8 promoting densification among the particles 9 by contraction with heat, and a liquid medium. The composition for transparent conductive film formation is supplied on a base plate 7 to form a coating film 81, and by applying heat treatment to the coating film 81 later, the transparent conductive film 82 can be obtained. It is preferable that the densification promoting agent 8 reduces its weight by 10% or more when it is heated from a room temperature to 400°C. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005078984(A) 申请公布日期 2005.03.24
申请号 JP20030309369 申请日期 2003.09.01
申请人 SEIKO EPSON CORP 发明人 MATSUSHITA AKIRA;SATO MITSURU;KOIKE TAKASHI;SEKI SHINSUKE
分类号 H01L21/28;H01B1/20;H01B5/14;H01B13/00;H01L21/288;H01L21/3205;H01L23/52;(IPC1-7):H01B1/20;H01L21/320 主分类号 H01L21/28
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