发明名称 RADIATION DETECTOR AND RADIATION IMAGING APPARATUS
摘要 PROBLEM TO BE SOLVED: To easily carry out contacting with an electrode formed on a semiconductor element, and to reduce the cost of a maintenance for defective semiconductor devices. SOLUTION: A radiation detector 14 is built up by laminating a semiconductor device 12A of a detector element 12 and a semiconductor device 13A of a detector element 13 so that signal read electrodes 12C, 13C are sandwiched between them. Furthermore, the detector element 12 is made longer than the detector element 13 by a dimension L, thereby partially exposing the signal read electrode 12C which is either of the signal read electrodes 12C, 13C from the signal read electrode 13C being the other electrode. Then, the radiation detector 14 is engaged into a protection connector case 15, thereby bringing the signal read electrode 12C to be in wide plane contact with an electrode contact member 17, formed on the inner wall of the protection connector case 15 and establishing their electrical connection. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005077189(A) 申请公布日期 2005.03.24
申请号 JP20030306399 申请日期 2003.08.29
申请人 HITACHI LTD 发明人 YOKOI KAZUMA;KITAGUCHI HIROSHI;TSUCHIYA KAZUTOSHI;AMAMIYA KENSUKE;UENO YUICHIRO;YANAGIDA NORIFUMI;KOJIMA SHINICHI
分类号 G01T1/24;G01T1/161;H01L31/09;(IPC1-7):G01T1/24 主分类号 G01T1/24
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