| 摘要 |
PROBLEM TO BE SOLVED: To prevent a packaged epoxy resin molding material from absorbing moisture, to facilitate taking out and handling of the molding material when molding is performed after returning it to a normal temperature, and to decrease inferiority of molding, inferiority of continuity and cracking at high temperature of a semiconductor device sealed by using this molding material. SOLUTION: A packaging body comprises a packaging bag made of a plastic film for packaging which is made into a bag by sealing processing, and the epoxy resin molding material for sealing the semiconductor stored in the packaging bag. In this packaging body for the epoxy resin molding material for sealing the semiconductor, at least one of a notch and a ripple cut is formed from an end part of the packaging bag toward a sealing region for bag manufacturing, or in the sealing region. COPYRIGHT: (C)2005,JPO&NCIPI
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