发明名称 TRANSFERRING METHOD, PEELING METHOD, AND PEELING DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce the electrostatic breakdown of elements in a transferring method in which the elements are transferred to a transferred substrate by peeling the elements from an original substrate. SOLUTION: The transferring method in which the elements 306 formed on the original substrate 300 are transferred to the transferred substrate 308 includes a laminating step of laminating the substrates 300 and 308 to each other by laminating the elements 306 to the substrate 308, an injecting step of injecting an ionized fluid into the interfaces between the elements 306 and substrate 300, and a transferring step of transferring the elements 306 to the substrate 308 by peeling the substrate 300 from the elements 306 at the interfaces into which the ionized fluid is injected. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005079553(A) 申请公布日期 2005.03.24
申请号 JP20030311917 申请日期 2003.09.03
申请人 SEIKO EPSON CORP 发明人 UTSUNOMIYA SUMIO
分类号 H01L27/12;H01L21/02;H01L21/336;H01L29/786;(IPC1-7):H01L27/12 主分类号 H01L27/12
代理机构 代理人
主权项
地址