| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible wiring layer in a semiconductor chip without interposing any interposer substrate. <P>SOLUTION: After an element forming region R1 on which electrode pads 2 are formed and a dummy region R2 are provided in a semiconductor substrate 1 and stress relieving layers 3a and 3b and rearranged wiring 4a and 4b are formed on the substrate 1, a chip-sized package CSP1 is formed on the substrate 1 and, at the same time, the flexible wiring layer FB1 which is integrally provided with the package CSP1 and protruded from the substrate 1 is formed by removing the semiconductor substrate 1 in the dummy region R2. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
