发明名称 WOOD-BASED RESIN COMPOSITION AND WOOD-BASED RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To obtain a wood-based resin composition and a wood-based resin molding that prevent occurrence of scorching of a wood-based filler in molding, raise the upper limit of molding temperature and reduce chargeability of molding in a wood-based resin composition and a wood-based resin molding comprising a thermoplastic resin and a wood-based filler as main components. SOLUTION: The surface of a wood-based filler such as wood flour, etc., is previously provided with a thin film composed of a metal or an inorganic compound, especially a metal or an inorganic compound having electroconductivity and about 2-50 nm, preferably about 5-50 nm thickness by a vacuum deposition method, a sputtering method, etc. The wood-based filler is prevented from heat during molding and processing, scorching hardly occurs and a molding is provided with electroconductivity by the thin film having excellent heat resistance to eliminate the problem of dust attraction by electrification. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005075883(A) 申请公布日期 2005.03.24
申请号 JP20030306121 申请日期 2003.08.29
申请人 TOPPAN PRINTING CO LTD 发明人 OKAMOTO YUMIKO
分类号 C08L101/00;C23C14/20;(IPC1-7):C08L101/00 主分类号 C08L101/00
代理机构 代理人
主权项
地址