Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias

摘要

A method for forming a conductive via in a semiconductor component is disclosed. The method includes providing a substrate having a first surface and an opposing, second surface. At least one hole is formed in the substrate extending between the first surface and the opposing, second surface. A seed layer is formed on a sidewall defining the at least one hole of the substrate and coated with a conductive layer, and a conductive or nonconductive filler material is introduced into the remaining space within the at least one hole. A method of forming a conductive via through a substrate using a blind hole is also disclosed. Semiconductor components and electronic systems having substrates including the conductive via of the present invention are also disclosed.