发明名称 Method for controlling critical dimensions during an etch process
摘要 A method for controlling dimensions of structures formed on a substrate using an etch process includes measuring pre-etch dimensions of the respective elements of a patterned etch mask and adjusting a process recipe of the etch process using the results of the pre-etch measurements. In one application, the method is used to control critical dimensions of a gate structure of a field effect transistor.
申请公布号 US2005064714(A1) 申请公布日期 2005.03.24
申请号 US20030666317 申请日期 2003.09.19
申请人 APPLIED MATERIALS, INC. 发明人 MUI DAVID;LIU WEI;SASANO HIROKI;YOO KYEONGRAN
分类号 H01L21/28;H01L21/00;H01L21/302;H01L21/306;H01L21/3065;H01L21/311;H01L21/3213;H01L21/336;H01L21/461;H01L21/66;H01L29/423;H01L29/49;H01L29/78;(IPC1-7):H01L21/302 主分类号 H01L21/28
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