发明名称 Developing method for semiconductor substrate
摘要 Embodiments of the present invention provide a developing method, which can efficiently prevent the developing solution from remaining on the backside surface of the wafer, so as to avoid the influence of the contamination on the subsequent processes. In one embodiment, a developing method comprises providing a wafer in a reaction space, wherein the wafer has an exposed photoresist thereon; coating a developing solution on a surface of the wafer; rotating the wafer; rinsing a normal surface and a backside surface of the wafer; and stopping rinsing the normal surface of the wafer while keeping rinsing the backside surface of the wafer for a specific time period.
申请公布号 US2005063699(A1) 申请公布日期 2005.03.24
申请号 US20040817567 申请日期 2004.04.01
申请人 MOSEL VITELIC, INC. 发明人 LIN CHEN TANG;YEH CHUNG CHIH;PENG KO WEI;WU MING FENG
分类号 G03F7/30;G03B27/42;G03D5/00;H01L21/02;H01L21/027;(IPC1-7):G03D5/00 主分类号 G03F7/30
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