| 摘要 |
1,152,735. Semi-conductor devices. TELEFUNKEN PATENTVERWERTUNGS G.m.b.H. 21 Sept., 1966 [19 Oct., 1965], No. 42158/66. Heading H1K. A strip or sheet of insulating material is provided with recesses to receive the electrode leads of several semi-conductor components and with metallic contact areas adjacent the recesses, the leads are pushed into the recesses and electrically connected to the contact areas and then, after low resistance contact has been made between the electrodes of semi-conductor elements mounted on the strip or sheet and the contact areas, the strip or sheet is subdivided into pieces carrying individual elements. Typically the strip 3 (Fig. 3) is of beryllia or other ceramic, is divided by transverse grooves etched, milled, or impressed, in the ceramic before firing, and has contact areas of aluminium, gold, or gold alloy formed on it by screen printing, or by vapour or electrolytic deposition. As shown, planar transistors are soldered by their collector zones to one contact areas and have flying leads thermo-compression bonded between the other contact areas and their emitters and bases. Header leads 13, 14 ,15 are connected to the contact areas by solder rings 16, the strip broken at the grooves and caps sealed to the headers. The holes may be replaced by notches in the edges of the strip and annular grooves used so that the broken off parts match the shape of the header. In a further arrangement a sheet with a two dimensional array of contact areas is used. In this case free leads are placed in the holes and after the electrical connections have been completed the upper face of the sheet is coated with epoxide resin prior to subdivision to protect the elements. |
