发明名称 HIGH-PERFORMANCE COOLING DEVICE HAVING WATER VAPOR CHAMBER
摘要 PROBLEM TO BE SOLVED: To provide a cooling device having a vapor chamber capable of maintaining heat transfer to a phase change liquid even when tilted from the vertical axis. SOLUTION: The cooling device comprises a heat mass (11) to which a plurality of vanes (21) are mounted, a thermal core (40) communicating with a base (17) of the heat mass (11) and having a step surface (14s) extending into a chamber hole (14a) of the heat mass (11) and a mounting surface (19) capable of thermally connecting the thermal core (40) and the heat mass (11) to components, a plug having a plurality of plug fins (42) arranged discretely and connected to the heat mass (11), a vapor chamber (41) composed of a plug cavity (14b), the chamber hole (14a), and the different-in-level surface (14s), and a phase change liquid (41L) sealed in the vapor chamber (41) under low pressure and in contact with a part of the step surface (14s). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005079579(A) 申请公布日期 2005.03.24
申请号 JP20040245339 申请日期 2004.08.25
申请人 HEWLETT-PACKARD DEVELOPMENT CO LP 发明人 HEGDE SHANKAR
分类号 H05K7/20;H01L23/427;H01L23/467;(IPC1-7):H01L23/427 主分类号 H05K7/20
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