发明名称 MOISTURE-CURABLE HOT-MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a moisture-curable hot-melt adhesive composition having at least one improved property of adhesiveness, heat resistance and solvent resistance in comparison with a conventional moisture-curable hot-melt adhesive. SOLUTION: The moisture-curable hot-melt adhesive composition comprises (A) a terminal isocyanate group-containing polyurethane prepolymer that has >1.0 isocyanate index and the number of isocyanate groups contained in one molecule of <2.5 on the average, (B) a silane coupling agent being an organoalkoxysilane and (C) a polyfunctional polyisocyanate having the number of isocyanate groups contained in one molecule of≥2.5 on the average. The adhesive composition is useful for producing an interior member for construction and suitably useful for coating a base material with a decorative sheet. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005075877(A) 申请公布日期 2005.03.24
申请号 JP20030306018 申请日期 2003.08.29
申请人 NIPPON NSC LTD 发明人 MATSUKI YUICHI;HATTORI KAZU;IKEDA HAJIME
分类号 C09J175/04;(IPC1-7):C09J175/04 主分类号 C09J175/04
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