发明名称 Method of fabricating a semiconductor component with active regions separated by isolation trenches
摘要 To form a semiconductor component having active regions separated from one another by trenches as isolation structures, a method involves forming a shallow trench in a semiconductor body, thereafter forming a deep trench within the shallow trench in the semiconductor body, and thereafter completely driving dopant atoms into the semiconductor body to form a well region doped with the dopant. The dopant may be previously introduced by implantation into a surface layer, and then the dopant is finally completely driven into the well region by thermally supported diffusion after forming the deep trench. The shallow and deep trenches together form a compound trench with stepped side walls. Two oppositely doped wells may be formed on opposite sides of the compound trench, which thus isolates the two wells from one another. Active regions may be formed in the two wells.
申请公布号 US2005064678(A1) 申请公布日期 2005.03.24
申请号 US20040945720 申请日期 2004.09.20
申请人 ATMEL GERMANY GMBH 发明人 DUDEK VOLKER;GRAF MICHAEL
分类号 H01L21/762;(IPC1-7):H01L21/76 主分类号 H01L21/762
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