| 发明名称 |
HIGH POWER MCM PACKAGE |
| 摘要 |
<p>A multi-chip module (54) that includes a conductive element to serve as an electrical connector for electrically connecting respective electrical contacts of at least two power semiconductor devices (30, 42) and serving as an output connector. The conductive element improving heat transfer from the power semiconductor devices through the top of the module.</p> |
| 申请公布号 |
KR20050029216(A) |
申请公布日期 |
2005.03.24 |
| 申请号 |
KR20057000803 |
申请日期 |
2005.01.15 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
SCHAFFER, CHRISTOPHER, P. |
| 分类号 |
H01L25/07;(IPC1-7):H01L21/60;H01L23/48 |
主分类号 |
H01L25/07 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
