发明名称 Ion implant dose control
摘要 This invention is concerned with the control of implanting ions into a substrate, such as doping semiconductor wafers. The ion beam is measured to ensure waters are implanted with the correct, uniform ion dose. The incident ion beam comprises ions and neutrals, yet detectors measure only ions. The ions/neutrals ratio varies with the ion implanter's chamber pressure that in turn is known to rise and fall when the ion beam is on and off the wafer respectively, according to a characteristic time constant. This invention provides methods of correcting measured ionic currents to account for neutrals using the time constant. Initially an assumed time constant is used that is later improved by measuring the ionic current after a delay sufficient to allow the chamber pressure to recover to its base value. The time constant may also be improved by removing any quadratic variation in already determined true beam current values.
申请公布号 US6870170(B1) 申请公布日期 2005.03.22
申请号 US20040792394 申请日期 2004.03.04
申请人 APPLIED MATERIALS, INC. 发明人 FARLEY MARVIN;SAKASE TAKAO
分类号 H01J37/304;H01J37/317;H01L21/265;(IPC1-7):H01J37/304 主分类号 H01J37/304
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