| 摘要 |
A micromirror array 110 fabricated on a semiconductor substrate 11. The array 110 is comprised of three operating layers 12, 13, 14. An addressing layer 12 is fabricated on the substrate. A hinge layer 13 is spaced above the addressing layer 12 by an air gap. A mirror layer 14 is spaced over the hinge layer 13 by a second air gap. The hinge layer 13 has a hinge 13a under and attached to the mirror 14a, the hinge 13a permitting the mirror 14a to tilt. Spring tips 13c under the mirror 14a are attached to the underside of the mirror 14a. These spring tips 13c tilt with the mirror 14a and provide a landing point for the mirror 14a onto a surface of the underlying pixel element structure.
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