发明名称 |
Semiconductor chip with external connecting terminal |
摘要 |
A semiconductor device having a semiconductor chip and protective resin covering a sidewall of the semiconductor chip and having a surface formed so as to be flush with an inactive surface of the semiconductor chip. The semiconductor chip may be joined to a wiring board or another semiconductor chip. The semiconductor device may further include an external connecting terminal having an exposed portion exposed to the outside of the protective resin.
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申请公布号 |
US6870248(B1) |
申请公布日期 |
2005.03.22 |
申请号 |
US20000588628 |
申请日期 |
2000.06.07 |
申请人 |
ROHM CO., LTD. |
发明人 |
SHIBATA KAZUTAKA |
分类号 |
H01L25/18;H01L21/301;H01L21/304;H01L21/56;H01L21/60;H01L23/12;H01L23/28;H01L23/31;H01L25/065;H01L25/07;(IPC1-7):H01L23/02 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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