| 摘要 |
A fabrication method of a window-type ball grid array (WBGA) semiconductor package is provided. With a chip being mounted over an opening formed through a substrate and electrically connected to the substrate by bonding wires through the opening, a molding process is performed to form a first encapsulant for encapsulating the chip. Then, a printing process is performed to form a second encapsulant for filling the opening and encapsulating the bonding wires. Finally, a plurality of solder balls are implanted on the substrate at area outside the second encapsulant. By implementing the molding process first and then the printing process, problems such as chip cracks, bond pad contamination and delamination generated in the prior art, can be eliminated.
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