A SEMICONDUCTOR DEVICE HAVING A POCKET LINE AND FABRICATION METHOD THEREOF

摘要

A semiconductor device and a manufacturing method thereof are provided to prevent the oxidation of metal patterns due to a thermal oxidation by enclosing lower and upper metal lines with a metal line capping pattern and a pocket conductive line. An isolation layer for defining an active region is formed on a semiconductor substrate(100). A molding hole(120) is formed within the active region. A pocket insulating pattern(139) is partially formed along an upper surface of the resultant structure. A pocket metal line(155) composed of a pocket conductive line(145), a lower metal line(149) and an upper metal line(152) is formed on the pocket insulating pattern to fill completely the molding hole. A metal line capping pattern(165) is formed on the pocket metal line. The lower and upper metal lines are enclosed with the pocket conductive line.