发明名称 HEAT ACCUMULATING BUILDING MATERIAL AND ITS USE
摘要 PROBLEM TO BE SOLVED: To provide a heat accumulating building material having strength and workability similar to an ordinary building material, and extremely easily maintaining comfortable room temperature over a long time by using an existing hollow building material as it is, in the heat accumulating building material fixed with a microcapsule containing a heat accumulating material. SOLUTION: A microcapsule solid material containing the heat accumulating material is filled in an inside space of the building material having a hollow structure. The average particle size of the microcapsule solid material is desirably in a range of 20μm to 30 mm. Desirably, this method uses the heat accumulating building material as an architectural interior material by using the microcapsule containing the heat accumulating material having a melting point in a range of 5 to 40°C, and uses the building material as a floor heating floor material by using the microcapsule containing the heat accumulating material having a melting point in a range of 30 to 80°C. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005068954(A) 申请公布日期 2005.03.17
申请号 JP20030303982 申请日期 2003.08.28
申请人 MITSUBISHI PAPER MILLS LTD 发明人 ISHIGURO MAMORU
分类号 B27M3/00;B27M3/04;E04B1/74;(IPC1-7):E04B1/74 主分类号 B27M3/00
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