HIGH IMPEDANCE SUBSTRATE

摘要

A high-impedance substrate comprising a first layer (1) made of an insulating material, having a lower surface and a top surface. The substrate comprises conductor patterns (3) which are mechanically linked to the substrate. The invention is characterized in that some of the conductor patterns (3) which are mechanically linked to the substrate are associated with a magnetic tile (5) and in that at least one electric interconnection (13) is used to connect two distinct points (9, 11) of a conductor pattern (3) which is mechanically linked to the substrate, said conductor pattern(3) having an associated magnetic tile (5) passing above the magnetic tile (5) associated with the conductor pattern (3) which is mechanically linked to the substrate.