发明名称 |
Methods and apparatus for removing conductive material from a microelectronic substrate |
摘要 |
A method and apparatus for removing conductive material from a microelectronic substrate is disclosed. One method includes disposing an electrolytic liquid between a conductive material of a substrate and at least one electrode, with the electrolytic liquid having about 80% water or less. The substrate can be contacted with a polishing pad material, and the conductive material can be electrically coupled to a source of varying electrical signals via the electrolytic liquid and the electrode. The method can further include applying a varying electrical signal to the conductive material, moving at least one of the polishing pad material and the substrate relative to the other, and removing at least a portion of the conductive material while the electrolytic liquid is adjacent to the conductive material. By limiting/controlling the amount of water in the electrolytic liquid, an embodiment of the method can remove the conductive material with a reduced downforce.
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申请公布号 |
US2005056550(A1) |
申请公布日期 |
2005.03.17 |
申请号 |
US20040923441 |
申请日期 |
2004.08.20 |
申请人 |
LEE WHONCHEE;MOORE SCOTT E.;VAARTSTRA BRIAN A. |
发明人 |
LEE WHONCHEE;MOORE SCOTT E.;VAARTSTRA BRIAN A. |
分类号 |
B23H3/00;B23H5/06;B23H5/08;B24B37/04;C25F7/00;(IPC1-7):C25D5/02 |
主分类号 |
B23H3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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