发明名称 |
MANUFACTURING METHOD FOR GLASS SUBSTRATE FOR ELECTRONIC DEVICE, MANUFACTURING METHOD FOR MASK BLANK, AND MANUFACTURING METHOD FOR TRANSFER MASK |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide manufacturing methods for a glass substrate for an electronic device and a mask blank with which no fine uneven surface defect occurs on a substrate surface or a failure rate is low, and a manufacturing method for a transfer mask free from a phase defect or a pattern defect caused by the fine uneven surface defect on the substrate surface. <P>SOLUTION: The glass substrate for an electronic device is manufactured by pushing polishing surface plates 5 and 6 with a polishing pad 7 glued against the glass substrate and relatively moving the plates 5 and 6 and the glass substrate while feeding a polishing fluid containing colloidal silica abrasive grains thereby precision-polishing the substrate surface. The polishing pad 7 used in precision-polishing has a base material and a nap layer having a fine aperture on the surface with a thickness of 700 μm or more. Hardness of the pad (Asker-C) is 65 or less. A mask blank and a transfer mask are manufactured by using the glass substrate thus manufactured. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005066781(A) |
申请公布日期 |
2005.03.17 |
申请号 |
JP20030301615 |
申请日期 |
2003.08.26 |
申请人 |
HOYA CORP |
发明人 |
KIKUCHI TOSHIHARU;KOIKE KESAHIRO |
分类号 |
B24B37/20;B24B37/24;G03F1/24;G03F1/60;H01L21/027 |
主分类号 |
B24B37/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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