| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat resistant photo-curable/heat-curable composition that permits direct writing, as solder resist ink, on a printed wiring board with use of an inkjet printer; to provide its cured product; and to provide a printed wiring board with a solder resist pattern formed thereon using it. <P>SOLUTION: The photo-curable/heat curable composition for inkjet contains (A) an acid anhydride, (B) a liquid compound having a cyclic ether group such as oxirane group or oxetanyl group, (C) a photoreactive diluent, and (D) a photopolymerization initiator, and has viscosity of≤150 mPa s at 25°C. Using the composition the solder resist pattern is directly drawn on the printed wiring board with the inkjet printer, which is primarily cured by irradiation of an active energy ray and then further heat cured. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
