发明名称 DISK DRIVE
摘要 PROBLEM TO BE SOLVED: To provide a disk drive provided with a heat radiator. SOLUTION: This device is provided with a printed circuit board 150 which is installed at the back of a base member 111 and in which at least one chip is incorporated, a first insulation panel 160 arranged between the base member and the printed circuit board, at least one heat conductive plates 171a, 171b, 171c arranged between a first insulation panel and the printed circuit board and absorbing and conducting heat generated by the at least one chip, and heat dissipative plates 172a, 172b, 172c connected to the heat conductive plate, dissipating heat exposed to the outside of the disk drive and conducted through the heat conductive plate to the outside. heat generated by a semiconductor chip of the printed circuit board is dissipated to the outside quickly and easily through the heat conductive plate and the heat dissipative plate consisting of metal, reduction of performance of the disk drive due to rise of temperature and damage of the semiconductor chip due to overheat are prevented. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005071585(A) 申请公布日期 2005.03.17
申请号 JP20040241624 申请日期 2004.08.20
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 YOO YONG-CHUL
分类号 G11B25/04;G11B33/12;G11B33/14;H05K1/02;(IPC1-7):G11B33/14 主分类号 G11B25/04
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