发明名称 Polishing pad for chemical mechanical polishing
摘要 The present invention provides in one embodiment, a polishing pad 100 for chemical mechanical polishing. The polishing pad comprises a polishing body 110. The polishing body comprises a thermoplastic foam substrate 115 having a surface 120 comprising concave cells 125. A polishing agent 130 coats an interior surface 135 of the concave cells. The polishing agent comprises an inorganic metal oxide that includes carbides or nitrides. Yet another embodiment of the present invention is a method for preparing a polishing pad 200.
申请公布号 US2005055885(A1) 申请公布日期 2005.03.17
申请号 US20040940582 申请日期 2004.09.14
申请人 PSILOQUEST 发明人 OBENG YAW S.
分类号 B24B37/04;B24D3/26;B24D3/34;B24D13/14;(IPC1-7):B24D3/00 主分类号 B24B37/04
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