METHOD AND DEVICE FOR FILLING MATERIAL SEPARATIONS ON A SURFACE

摘要

Disclosed are a method and a device for filling material separations on the surface. In methods known in prior art, which are used for filling material separations, the substrate is often influenced in a negative manner by high processing temperatures and dissimilar additives. The inventive method overcomes said disadvantage, taking place at low temperatures and allowing the material separation (4) to be completely filled without using dissimilar substances.