| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can perform the qualification test of a package in parallel without waiting for a design and the manufacture of an IC chip, and to provide a method for manufacturing the same. <P>SOLUTION: The semiconductor device includes a core circuit 1, an I/O cell 2 disposed around the core circuit 1, the outer peripheral part of a first chip region 3 disposed at the outside of the I/O cell, a first pad 7 disposed at the outside of the I/O cell and the inside of the outer peripheral part of the first chip region 3, the outer peripheral part of a second chip region 4 disposed at the outside of the outer peripheral part of the first chip region 3, and a second pad 8 disposed at the outside of the first chip region and the inside of the outer peripheral part of the second chip region. An IC package to be tested is manufactured by carrying the first chip or the second chip in a package, and a qualification test of the package is performed to the IC package to be tested. Thus, the qualification test of the package can be performed in parallel with the design and the manufacture of the IC chip for a product. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
