| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board that can surely remove noise, and lower resistance and inductance of the wiring board connected to a capacitor by housing the capacitor, and that can house a capacitor which loses less money even if defective conditions are encountered, is less expensive, and has big capacity. <P>SOLUTION: A wiring board 100 has a capacitor 20 within a through-hole 11 that is formed in a core substrate body 10, and resin insulation layers 41-43, 51-53 as well as wiring layers 45, 46, 55 and 56 thereon and thereunder. The capacitor 20 is configured to be connectable to upward and downward via pads 21, 22 that are formed on an upper surface 20A and a lower surface 20B. The connection of the pad 21 with the wiring the wiring layer 45, and the connection of the pad 22 with the wring layer 55 allow the connection of a flip chip pad 101 with multiple upper wirings 60 for connecting the capacitor, and the connection of an LGA pad 103 with multiple lower wirings 70 for connecting the capacitor. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
