| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor chip whose reliability can be improved while a high function by high density of highest layer wiring is realized. <P>SOLUTION: In the semiconductor chip 1, a plurality of first layer wiring 9, second layer wiring 13 to highest layer wiring 17 are laminated on a semiconductor substrate 3. Highest layer wiring 17 is formed of a pad 17a whose film is made thick, a large current 17b which is connected to the pad 17a and in which large current flows and a thin film 17c thinner than the large current 17b. A projected electrode 15 is arranged on the pad 17a through a contact layer 23. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
