| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device which prevents effectively advance of crack generated under a pad, and can pull out drawer wiring outside from each pad without spoiling crack prevention effect. SOLUTION: By the wiring layer 63 of the identical hierarchy to a pad 3, a wiring layer 62 of the lower hierarchy than the pad 3 and a connection hole 73, the crack prevention wall 11 of the shape of a gutter is formed which encloses outside enclosure of bottom surface of the pad 3 and right and left side surfaces and extends along the arrangement direction of pad 3. An opening 11a is formed in accordance with every pad 3 on the crack prevention wall 11. Lead wiring 12 for connecting the pad 3 with circuit element 2 electrically is pulled out by exterior of the crack prevention wall 11 through each opening 11a. COPYRIGHT: (C)2005,JPO&NCIPI |
