发明名称 Method of detecting and classifying scratches, particles and pits on thin film disks or wafers
摘要 Scratches, pits and particles which are smaller or larger than the beam size may be measured and identified by a dual beam technique. This invention uses a pair of orthogonally oriented laser beams, one in the radial and one in the circumferential direction. The scattered light from radial and circumferential beams allows the detection and classification of particles, pits and scratches.
申请公布号 US2005057747(A1) 申请公布日期 2005.03.17
申请号 US20040973855 申请日期 2004.10.25
申请人 MEEKS STEVEN W. 发明人 MEEKS STEVEN W.
分类号 G01B11/06;G01B11/30;H01L21/66;(IPC1-7):G01N21/88 主分类号 G01B11/06
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