发明名称 INSPECTION METHOD OF SEMICONDUCTOR DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a simple inspection method for determining correctness of wiring connection when a flexible printed wiring board is wired (mounted) on a flexible board. <P>SOLUTION: The inspection method inspects electrical connection between the external connection terminal group (11) of a flexible circuit board (10) where a thin film circuit is formed and the connection terminal group (21) of an external wiring board (20). It includes a step where an inter-terminal wiring pattern (12) for connecting external terminals is formed at a plurality of external connection terminals, among external connection terminals on the flexible circuit board; a step where the external connection terminals of the flexible circuit board are electrically connected to the connection terminals of the external wiring board; and a step for measuring a resistance value for one or more wiring paths (12) by way of any two external connection terminals (11L and 11R), connected with the inter-terminal wiring pattern through the connection parts (11 and 21) of the flexible circuit board and the external wiring board from the external wiring board side. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005069945(A) 申请公布日期 2005.03.17
申请号 JP20030301961 申请日期 2003.08.26
申请人 SEIKO EPSON CORP 发明人 HARA HIROYUKI
分类号 G01R31/02;G01R27/02;G02F1/1345;H01L21/60;H01L51/50;H01R12/28;H05B33/12;H05B33/14;(IPC1-7):G01R31/02 主分类号 G01R31/02
代理机构 代理人
主权项
地址