CIRCUIT BOARD, HYBRID INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a circuit board that can allow a larger current to flow even if the width of a wiring pattern is not spread and can improve manufacturing properties. SOLUTION: A circuit pattern 24 of a lead frame 22 having conductivity is overlapped with a wiring pattern 11 provided on an epoxy substrate 10 that is an insulating substrate for fitting. Additionally, a terminal piece 25 for external connection is extended to the circuit pattern 24 of the lead frame 22. The lead frame 22 can be formed to several multiples of thicknesses without being affected by restrictions, such as the wiring pattern 11 formed on the epoxy substrate 10, thus allowing a large current to flow to the circuit pattern 24 and the terminal piece 25 connected to the circuit pattern 24 in one piece. COPYRIGHT: (C)2005,JPO&NCIPI