| 摘要 |
PROBLEM TO BE SOLVED: To enable the three-dimensional structure of a semiconductor chip to be reduced in thickness, without being restricted by the size of the semiconductor chip. SOLUTION: The projecting electrodes 2 of a semiconductor chip 1 are bonded on a wiring layer 4 formed on a flexible board 3 so as to mount the semiconductor chip 1 on a semiconductor chip mounting region R1 of the flexible board 3 in a flip-chip mounting manner, semiconductor chips 1a to 1c mounted on flexible boards 3a to 3c respectively are stacked up on a carrier board 11, and the flexible boards 3a to 3c are bent to connect the wiring layers 4a to 4c of the flexible boards 3a to 3c to the lands 12a and 12b of the carrier board 11. COPYRIGHT: (C)2005,JPO&NCIPI
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