| 摘要 |
PROBLEM TO BE SOLVED: To connect an IC or a semiconductor chip with a high reliability. SOLUTION: An electrode part 20 to which the metal electrode (bump) of an IC circuit will be connected from an upper part is formed on the glass substrate 11 of a liquid crystal display device. The electrode part 20 is constituted by opening an inter-layer insulating film 23 in a part corresponding to metal wiring 22 and forming a land-like electrode pad 25 in this opened part. In the present invention, the plane shape of the electrode pad 25 is made smaller than the opened part of the inter-layer insulating film 23. Thus the flatness of the peripheral surface of the electrode 20 is improved. COPYRIGHT: (C)2005,JPO&NCIPI
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