| 摘要 |
In a liquid applying step (131), a liquid (134) is sprayed through a spray nozzle (133) onto a printed wiring board (131) on which an electronic component is mounted in the preceding electronic component mounting step (121). In the following reflow soldering step (141), since the applied liquid (134) quickly transmits heat to a cream solder, at least a portion where the liquid is applied can be rapidly and uniformly heated. Consequently, this method enables a uniform soldering which is free from defects especially in the reflow soldering process using a lead-free solder with a high melting point.
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