| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing adhesive sheet which has no contamination with silicone components, maintains a sufficient modulus of elasticity event at high temperatures, and hardly causes a problem of leaving adhesives. <P>SOLUTION: The adhesive sheet 30 having a base layer 32 and an adhesive layer 31 is usable in a semiconductor device manufacturing process which at least seals a semiconductor element connected to conductors with a seal resin on the adhesive layer 31. The adhesive layer 31 of the sheet 30 contains a rubber component and an epoxy resin component, and the rubber component is 5-40 wt.% of organic compounds in the adhesive layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
